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Dry Etch module development engineer

About the position

This role operates in a high impact space, partnering closely with cross-functional teams (Process Integration, Manufacturing, Equipment Engineering, Yield/Defect Engineering, and suppliers) to solve complex technical challenges and establish long-term systems that sustain performance. The engineer will drive technology development for both high volume manufacturing and future technology, provide process integration and equipment solutions, and perform feasibility studies to meet desired device specifications. The role requires regular onsite presence to fulfill essential job responsibilities.

Responsibilities

Own and drive development of next generation patterning processes, including process architecture, optimization strategies, and qualification methodologies.
Perform pathfinding activities in support of process and hardware development on existing and first of kind equipment, enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap.
Provide technical leadership for cross-functional problem solving to resolve complex process and defect issues; drive structured root cause, containment, and permanent corrective actions.
Design and execute comprehensive characterization plans; plan and conduct experiments (DOE/response surface/robustness studies) across the development cycle.
Establish and mature control systems to optimize and sustain production performance (SPC, control plans, alarms, response plans, recipe governance, sustaining systems).
Develop strategies and infrastructure to resolve difficult problems and implement systems to manage these problems in the future (standard work, monitoring, dashboards/analytics, knowledge capture).
Drive improvements in yield, reliability, cost, productivity, and process capability, ensuring scalable transfer to manufacturing and ongoing sustainment.
Influence technical direction, mentor engineers (as appropriate for grade), and communicate status/risks clearly to stakeholders.
Recommend and implement modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products.
Partner with key equipment and materials suppliers to develop and implement enabling elements of the technology.
Perform process technology feasibility studies through theoretical simulations and/or practical engineering methods.

Requirements

PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of industry experience in dry etch at a leading foundry or equipment supplier with relevant experience.
Or - Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 6+ years of industry experience in dry etch at a leading foundry or equipment supplier with relevant experience.
Or -Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 8+ years of industry experience in dry etch at a leading foundry or equipment supplier with relevant experience.
Hands-on experience in dry etch semiconductor manufacturing, including ownership of process development and optimization.
Strong command of plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms.
Demonstrated record of delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability for advanced technology nodes at foundry or suppliers.
Expertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data-based decisions.

Nice-to-haves

5+ years of direct experience developing and deploying dry etch processes for advanced logic or foundry technologies.
Experience with advanced dry etch technologies such as: ICP / CCP plasma etch, High aspect ratio etch (HARC), Atomic Layer Etch (ALE), Radical and Vapor phase isotropic etching, Ash and surface treatments, EUV patterned layer etch integration.
Demonstrated ability to manage complex process challenges and provide solutions such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansion.
Strong understanding of logic BEOL interconnects and their etch integration requirements.
Experience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation.
Ability to define technical approaches, de risk options, and guide less senior engineers through complex problem solving.
Proven ability to lead technical problem solving across projects, influencing peers and stakeholders without formal people management responsibility.
Evidence of broader technical influence, such as internal technology disclosures, patents, publications, or recognized subject matter expertise within the organization.
Strong collaboration and problem-solving skills to work effectively in cross-disciplinary teams.
Proven ability to communicate technical data and concepts to both technical and non-technical audiences.

Benefits